15 October 2012 The thermal management of high power light emitting diodes
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Abstract
Thermal management had an important influence not only in the life time but also in the efficiency of high power light emitting diodes (HPLEDs). 30 watts in a single package have become standard to the industrial fabricating of HPLEDs. In this study, we fabricated both of the AlN porous films, by vacuum sputtering, soldered onto the HPLEDs lamp to enhance both of the heat transfer and heat dissipation. In our model, the ceramic enables transfer the heat from electric device to the aluminum plate quickly and the porous increase the quality of the thermal dissipation between the PCB and aluminum plate, as compared to the industrial processing. The ceramic films were characterized by several subsequent analyses, especially the measurement of real work temperature. The X-Ray diffraction (XRD) diagram analysis reveals those ceramic phases were successfully grown onto the individual substrates. The morphology of ceramic films was investigated by the atomic force microscopy (AFM). The results show those porous films have high thermal conduction to the purpose. At the same time, they had transferred heat and limited work temperature, about 70℃, of HPLEDs successfully.
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Ming-Seng Hsu, Ming-Seng Hsu, Jen-Wei Huang, Jen-Wei Huang, Feng-Lin Shyu, Feng-Lin Shyu, } "The thermal management of high power light emitting diodes", Proc. SPIE 8497, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications VI, 84971F (15 October 2012); doi: 10.1117/12.930241; https://doi.org/10.1117/12.930241
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