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Crystal-based x-ray optics are widely used in the synchrotron radiation field. Such optics include monochromators,
channel-cut crystals, spectral analyzers, and phase plates that are generally made with standard fabrication tools such as
grinders, ultrasonic mills, blade saws, and wire saws. However, modern synchrotron radiation instruments require more
complicated and high-precision crystal structures that cannot be fabricated by these conventional tools. Examples include
narrow channels and crystal cavities that require smooth and strain-free sidewalls or inner surfaces. Since it is extremely
difficult to polish such surfaces by conventional means, specialized cutting tools are required to make the as-cut surfaces
as smooth as possible. A possible way to obtain such smooth surfaces is to use a dicing saw as a fabrication tool - a tool
typically used in the microelectronics industry to cut or dice semiconductor and other materials. Here we present our
studies on the use of dicing saws for cutting innovative, monolithic, x-ray optic devices comprised of tall, narrow-standing,
thin crystal-plate arrays. We report cutting parameters that include the rotational speed of the cutting blade
(a.k.a. spindle speed), cutting speed (a.k.a. feed rate), number of passes for each cut depth (if required), and diamond grit
size for producing the flattest and most smooth side walls. Blade type and construction (sintered, Ni, and resin) also play
critical roles in achieving optimum results. The best experimental data obtained produced an average surface roughness
of 49 nm and a peak-to-valley flatness of 3625 nm. By achieving these results, we have been able to assist experimenters
in the synchrotron radiation field in their efforts to create functional and novel optical devices.
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