24 October 2012 320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging
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Abstract
Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum < 10-3 mbar, the authors have pushed forward the development of the technology on fully operational QVGA readout circuits CMOS base wafers (320 x 240 pixels). In this outlook, the article reports on the electro optical performance obtained from this preliminary PLP based QVGA demonstrator. Apart from the response, noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J-J. Yon, J-J. Yon, G. Dumont, G. Dumont, W. Rabaud, W. Rabaud, S. Becker, S. Becker, L. Carle, L. Carle, V. Goudon, V. Goudon, C. Vialle, C. Vialle, A. Hamelin, A. Hamelin, A. Arnaud, A. Arnaud, } "320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging", Proc. SPIE 8541, Electro-Optical and Infrared Systems: Technology and Applications IX, 85410D (24 October 2012); doi: 10.1117/12.974846; https://doi.org/10.1117/12.974846
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