26 February 2013 Liquid metal heat sink for high-power laser diodes
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Abstract
We report on the development of a novel, ultra-low thermal resistance active heat sink (AHS) for thermal management of high-power laser diodes (HPLD) and other electronic and photonic components. AHS uses a liquid metal coolant flowing at high speed in a miniature closed and sealed loop. The liquid metal coolant receives waste heat from an HPLD at high flux and transfers it at much reduced flux to environment, primary coolant fluid, heat pipe, or structure. Liquid metal flow is maintained electromagnetically without any moving parts. Velocity of liquid metal flow can be controlled electronically, thus allowing for temperature control of HPLD wavelength. This feature also enables operation at a stable wavelength over a broad range of ambient conditions. Results from testing an HPLD cooled by AHS are presented.
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John Vetrovec, John Vetrovec, Amardeep S. Litt, Amardeep S. Litt, Drew A. Copeland, Drew A. Copeland, Jeremy Junghans, Jeremy Junghans, Roger Durkee, Roger Durkee, } "Liquid metal heat sink for high-power laser diodes", Proc. SPIE 8605, High-Power Diode Laser Technology and Applications XI, 86050E (26 February 2013); doi: 10.1117/12.2005357; https://doi.org/10.1117/12.2005357
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