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29 March 2013 Laser processing of 2D and 3D metamaterial structures
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The field of metamaterials has expanded to include more than four orders of magnitude of the electromagnetic spectrum, ranging from the microwave to the optical. While early metamaterials operated in the microwave region of the spectrum, where standard printed circuit board techniques could be applied, modern designs operating at shorter wavelengths require alternative manufacturing methods, including advanced semiconductor processes. Semiconductor manufacturing methods have proven successful for planar 2D geometries of limited scale. However, these methods are limited by material choice and the range of possible feature sizes, thus hindering the development of metamaterials due to manufacturing challenges. Furthermore, it is difficult to achieve the wide range of scales encountered in modern metamaterial designs with these methods alone. Laser direct-write processes can overcome these challenges while enabling new and exciting fabrication techniques. Laser processes such as micromachining and laser transfer are ideally suited for the development and optimization of 2D and 3D metamaterial structures. These laser processes are advantageous in that they have the ability to both transfer and remove material as well as the capacity to pattern non-traditional surfaces. This paper will present recent advances in laser processing of various types of metamaterial designs.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nicholas A. Charipar, Kristin M. Charipar, Heungsoo Kim, Matthew A. Kirleis, Ray C. Y. Auyeung, Andrew T. Smith, Scott A. Mathews, and Alberto Piqué "Laser processing of 2D and 3D metamaterial structures", Proc. SPIE 8607, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVIII, 86070T (29 March 2013);

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