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Picosecond and nanosecond pulsed laser ablation of aluminium, polypropylene, polyethylene, and their thin-film combinations
Improvement of laser dicing system performance I: high-speed, high-quality processing of thick silicon wafers using spatial light modulator
Improvement of laser dicing performance II: dicing rate enhancement by multi beams and simultaneous aberration correction with phase-only spatial light modulator
UV laser writing system based on polar scanning strategy to produce subwavelength metal gratings for surface plasmon resonance
Ultrafast laser trimming for reduced device leakage in high performance OTFT semiconductors for flexible displays
Cellular scanning strategy for selective laser melting: evolution of optimal grid-based scanning path and parametric approach to thermal homogeneity