Laser transfer of reconfigurable patterns with a spatial light modulator

Alberto Piqué; Ray C. Y. Auyeung; Andrew T. Smith; Heungsoo Kim; Scott A. Mathews; Nicholas A. Charipar; Matthew A. Kirleis

doi:10.1117/12.2005345

15 March 2013 Laser transfer of reconfigurable patterns with a spatial light modulator

Alberto Piqué, Ray C. Y. Auyeung, Andrew T. Smith, Heungsoo Kim, Scott A. Mathews, Nicholas A. Charipar, Matthew A. Kirleis

Author Affiliations +

Proceedings Volume 8608, Laser-based Micro- and Nanopackaging and Assembly VII; 86080K (2013) https://doi.org/10.1117/12.2005345
Event: SPIE LASE, 2013, San Francisco, California, United States

Abstract

Laser forward transfer of arbitrary and complex configurable structures has recently been demonstrated using a spatial light modulator (SLM). The SLM allows the spatial distribution of the laser pulse, required by the laser transfer process, to be modified for each pulse. The programmable image on the SLM spatially modulates the intensity profile of the laser beam, which is then used to transfer a thin layer of material reproducing the same spatial pattern onto a substrate. The combination of laser direct write (LDW) with a SLM is unique since it enables LDW to operate not only in serial fashion like other direct write techniques but instead reach a level in parallel processing not possible with traditional digital fabrication methods. This paper describes the use of Digital Micromirror Devices or DMDs as SLMs in combination with visible (λ = 532 nm) nanosecond lasers. The parallel laser printing of arrayed structures with a single laser shot is demonstrated together with the full capabilities of SLMs for laser printing reconfigurable patterns of silver nano-inks Finally, an overview of the unique advantages and capabilities of laser forward transfer with SLMs is presented.

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Alberto Piqué, Ray C. Y. Auyeung, Andrew T. Smith, Heungsoo Kim, Scott A. Mathews, Nicholas A. Charipar, and Matthew A. Kirleis "Laser transfer of reconfigurable patterns with a spatial light modulator ", Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080K (15 March 2013); https://doi.org/10.1117/12.2005345

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