15 March 2013 Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices
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Abstract
Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is ≤ 500 μm/side. Such ultrathin, ultra-small dice provide the flexibility and low cost required, but no conventional technology today can package such die onto a flexible substrate at low cost and high rate. The laser-enabled advanced packaging (LEAP) technology has been developed at the Center for Nanoscale Science and Engineering, North Dakota State University in Fargo, North Dakota, to accomplish this objective. Presented are results using LEAP to assemble dice with various thicknesses, including 350 μm/side dice as thin as 20 μm and less. To the best of our knowledge, this is the first report of using a laser to package conventional silicon dice with such small size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.
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Val R. Marinov, Orven Swenson, Yuriy Atanasov, Nathan Schneck, "Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices", Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080L (15 March 2013); doi: 10.1117/12.2004344; https://doi.org/10.1117/12.2004344
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