9 March 2013 Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods
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Abstract
In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called “membrane method”. Persistence of the vacuum was proven. No getter materials were used for packaging.
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S. Langa, S. Langa, C. Drabe, C. Drabe, C. Kunath, C. Kunath, A. Dreyhaupt, A. Dreyhaupt, H. Schenk, H. Schenk, } "Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods", Proc. SPIE 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII, 86140F (9 March 2013); doi: 10.1117/12.2003525; https://doi.org/10.1117/12.2003525
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