13 March 2013 2D electrostatic micromirror array with high field factor for high-power application
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This paper reports the fabrication of a 20×20 micro mirror array (MMA) designed for high optical power application (5- 8kW/m2). Each pixel can attain a 2D mechanical tilt angle of +/- 4° in any arbitrary axis with an applied voltage of 150V. A novel packaging architecture is proposed to increase the ratio of mirror surface to packaging surface based on fully vertically integration process of the actuation (vertical electrodes), electrical interconnections (TSV) and signal processing (electronic). All components have a pitch smaller than the mirror surface. A detailed assessment of the fabrication process - including 3D wafer level assembly, through silicon via (TSV), electronic integration, and characterization methodology is presented with experimental results.
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S. Lani, S. Lani, D. Bayat, D. Bayat, Y. Pétremand, Y. Pétremand, "2D electrostatic micromirror array with high field factor for high-power application", Proc. SPIE 8616, MOEMS and Miniaturized Systems XII, 86160I (13 March 2013); doi: 10.1117/12.2002990; https://doi.org/10.1117/12.2002990

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