11 March 2013 Polish-like facet preparation via dicing for silica integrated optics
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Proceedings Volume 8621, Optical Components and Materials X; 862107 (2013) https://doi.org/10.1117/12.2004342
Event: SPIE OPTO, 2013, San Francisco, California, United States
Abstract
Preparation of high quality facets for low-loss coupling is a significant production issue for integrated photonics, usually requiring time consuming lapping and polishing. Recently, the development of precision dicing saws with diamond impregnated blades has allowed the achievement of optical grade surfaces in optical materials based on dicing alone. In this report we investigate the optimization dicing conditions to achieve optical quality surfaces in a silica-on-silicon planar substrate and show what can be achieved by correct selection of machining parameters.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. G. Carpenter, L. G. Carpenter, H. L. Rogers, H. L. Rogers, C. Holmes, C. Holmes, J. C. Gates, J. C. Gates, P. G. R. Smith, P. G. R. Smith, } "Polish-like facet preparation via dicing for silica integrated optics", Proc. SPIE 8621, Optical Components and Materials X, 862107 (11 March 2013); doi: 10.1117/12.2004342; https://doi.org/10.1117/12.2004342
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