18 March 2013 The effects of deposition conditions and annealing temperature on the performance of gallium tin zinc oxide thin film transistors
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Proceedings Volume 8626, Oxide-based Materials and Devices IV; 862615 (2013) https://doi.org/10.1117/12.2013277
Event: SPIE OPTO, 2013, San Francisco, California, United States
Abstract
In this work the performance of bottom gate thin film transistors (TFTs) with transparent amorphous gallium tin zinc oxide (GSZO) active layers fabricated by radio frequency sputter deposition using a single GSZO target on SiO2/Si wafers will be presented. Trap density and its energetic distribution, and oxygen chemisorption were found to play a critical role in determining the operational characteristics of the device, all of which can be controlled by the oxygen incorporation and substrate temperature during deposition, along with the post-deposition annealing. In addition device instability, with respect to the electrical stress and optical illumination, can be suppressed by suitably tailoring these parameters. TFTs exhibiting a drain current (ID) of 10-6 A and on/off current ratio (Ion/off ) of 106 was achieved. A stable TFT has been achieved under electrical stress for 2% oxygen flow exhibiting ΔVT as low as ~0.5 V for 3hr stress under a gate bias of 1.2 and 12 V, with good optical stability.
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Tanina Bradley, Tanina Bradley, Shanthi Iyer, Shanthi Iyer, Robert Alston, Robert Alston, Ward Collis, Ward Collis, Jay Lewis, Jay Lewis, Garry Cunningham, Garry Cunningham, Eric Forsythe, Eric Forsythe, } "The effects of deposition conditions and annealing temperature on the performance of gallium tin zinc oxide thin film transistors", Proc. SPIE 8626, Oxide-based Materials and Devices IV, 862615 (18 March 2013); doi: 10.1117/12.2013277; https://doi.org/10.1117/12.2013277
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