6 March 2013 III-V/silicon photonic integrated circuits for communication and sensing applications
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Abstract
In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.
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Gunther Roelkens, Shahram Keyvaninia, Stevan Stankovic, Yannick De Koninck, Martijn Tassaert, Pauline Mechet, Thijs Spuesens, N. Hattasan, A. Gassenq, M. Muneeb, E. Ryckeboer, Samir Ghosh, D. Van Thourhout, R. Baets, "III-V/silicon photonic integrated circuits for communication and sensing applications", Proc. SPIE 8627, Integrated Optics: Devices, Materials, and Technologies XVII, 862707 (6 March 2013); doi: 10.1117/12.2001304; https://doi.org/10.1117/12.2001304
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