6 March 2013 III-V/silicon photonic integrated circuits for communication and sensing applications
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Abstract
In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gunther Roelkens, Gunther Roelkens, Shahram Keyvaninia, Shahram Keyvaninia, Stevan Stankovic, Stevan Stankovic, Yannick De Koninck, Yannick De Koninck, Martijn Tassaert, Martijn Tassaert, Pauline Mechet, Pauline Mechet, Thijs Spuesens, Thijs Spuesens, N. Hattasan, N. Hattasan, A. Gassenq, A. Gassenq, M. Muneeb, M. Muneeb, E. Ryckeboer, E. Ryckeboer, Samir Ghosh, Samir Ghosh, D. Van Thourhout, D. Van Thourhout, R. Baets, R. Baets, } "III-V/silicon photonic integrated circuits for communication and sensing applications", Proc. SPIE 8627, Integrated Optics: Devices, Materials, and Technologies XVII, 862707 (6 March 2013); doi: 10.1117/12.2001304; https://doi.org/10.1117/12.2001304
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