Thermal management and light extraction in multi-chip and high-voltage LEDs by cup-shaped copper heat spreader technology

Ray-Hua Horng; Hung-Lieh Hu; Li-Shen Tang; Sin-Liang Ou

doi:10.1117/12.2001435

4 March 2013 Thermal management and light extraction in multi-chip and high-voltage LEDs by cup-shaped copper heat spreader technology

Ray-Hua Horng, Hung-Lieh Hu, Li-Shen Tang, Sin-Liang Ou

Author Affiliations +

Proceedings Volume 8641, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XVII; 86410R (2013) https://doi.org/10.1117/12.2001435
Event: SPIE OPTO, 2013, San Francisco, California, United States

Abstract

For LEDs with original structure and copper heat spreader, the highest surface temperatures of 3×3 array LEDs modules were 52.6 and 42.67 °C (with 1050 mA injection current), while the highest surface temperatures of 4×4 array LEDs modules were 58.55 and 48.85 °C (with 1400 mA injection current), respectively. As the 5×5 array LEDs modules with original structure and copper heat spreader were fabricated, the highest surface temperatures at 1750 mA injection current were 68.51 and 56.73 °C, respectively. The thermal resistance of optimal LEDs array module with copper heat spreader on heat sink using compound solder is reduced obviously. On the other hand, the output powers of 3×3, 4×4 and 5×5 array LEDs modules with original structure were 3621.7, 6346.3 and 9760.4 mW at injection currents of 1050, 1400 and 1750 mA, respectively. Meanwhile, the output powers of these samples with copper heat spreader can be improved to 4098.5, 7150.3 and 10919.6 mW, respectively. The optical and thermal characteristics of array LEDs module have been improved significantly using the cup-shaped copper structure. Furthermore, various types of epoxy-packaged LEDs with cup-shaped structure were also fabricated. It is found that the light extraction efficiency of LED with semicircle package has 55% improvement as compared to that of LED with flat package. The cup-shaped copper structure was contacted directly with sapphire to enhance heat dissipation. In addition to efficient heat dissipation, the light extraction of the lateral emitting in high-power LEDs can be improved.

Citation Download Citation

Ray-Hua Horng, Hung-Lieh Hu, Li-Shen Tang, and Sin-Liang Ou "Thermal management and light extraction in multi-chip and high-voltage LEDs by cup-shaped copper heat spreader technology", Proc. SPIE 8641, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XVII, 86410R (4 March 2013); https://doi.org/10.1117/12.2001435

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available