1 April 2013 Low thermal expansion material (LTEM) cleaning and optimization for extreme ultraviolet (EUV) blank deposition
Author Affiliations +
With the insertion of extreme ultraviolet lithography (EUVL) for high volume manufacturing (HVM) expected in the next few years, it is necessary to examine the performance of low thermal expansion materials (LTEMs) and assess industry readiness of EUV substrates. Owing to the high cost of LTEM, most of the development work so far has been done on fused silica substrates. Especially in developing cleaning technology prior to multilayer deposition, fused silica substrates have been used extensively, and defect trends and champion blank data have been reported using multilayer deposition data on fused silica substrates. In this paper, the response of LTEMs to cleaning processes prior to multilayer deposition is discussed. Cleaning processes discussed in this paper are developed using fused silica substrates and applied on LTEM substrates. The defectivity and properties of LTEM to fused silica are compared. Using the dense scan feature of the substrate inspection tool capable of detecting defects down to 35 nm SiO2 equivalent size and appropriate defect decoration techniques to decorate small defects on substrates to make them detectable, cleaning technologies that have the potential to meet high demands on LTEM for EUVL are developed and optimized.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Arun John Kadaksham, Arun John Kadaksham, Ranganath Teki, Ranganath Teki, Milton Godwin, Milton Godwin, Matt House, Matt House, Frank Goodwin, Frank Goodwin, "Low thermal expansion material (LTEM) cleaning and optimization for extreme ultraviolet (EUV) blank deposition", Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86791R (1 April 2013); doi: 10.1117/12.2011718; https://doi.org/10.1117/12.2011718


Selete's EUV program: progress and challenges
Proceedings of SPIE (March 19 2008)
Development status of EUVL mask blank and substrate
Proceedings of SPIE (October 13 2011)
Development of mask materials for EUVL
Proceedings of SPIE (December 26 2002)

Back to Top