Directed self-assembly process implementation in a 300mm pilot line environment

Chi-Chun Liu; I. Cristina Estrada-Raygoza; Jassem Abdallah; Steven Holmes; Yunpeng Yin; Anthony Schepis; Michael Cicoria; David Hetzer; Hsinyu Tsai; Michael Guillorn; Melia Tjio; Joy Cheng; Mark Somervell; Matthew Colburn

doi:10.1117/12.2011610

26 March 2013 Directed self-assembly process implementation in a 300mm pilot line environment

Chi-Chun Liu; I. Cristina Estrada-Raygoza; Jassem Abdallah; Steven Holmes; Yunpeng Yin; Anthony Schepis; Michael Cicoria; David Hetzer; Hsinyu Tsai; Michael Guillorn; Melia Tjio; Joy Cheng; Mark Somervell; Matthew Colburn

Author Affiliations +

Proceedings Volume 8680, Alternative Lithographic Technologies V; 86801G (2013) https://doi.org/10.1117/12.2011610
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

The patterning capability of the directed self-assembly (DSA) of a 42nm-pitch block copolymer on an 84nm-pitch guiding pattern was investigated in a 300mm pilot line environment. The chemoepitaxy guiding pattern was created by the IBM Almaden approach using brush materials in combination with an optional chemical slimming of the resist lines. Critical dimension (CD) uniformity, line-edge/line-width roughness (LER/LWR), and lithographic process window (PW) of the DSA process were characterized. CD rectification and LWR reduction were observed. The chemical slimming process was found to be effective in reducing pattern collapse, hence, slightly improving the DSA PW under over-dose conditions. However, the overall PW was found to be smaller than without using the slimming, due to a new failure mode at under-dose region.

Citation Download Citation

Chi-Chun Liu, I. Cristina Estrada-Raygoza, Jassem Abdallah, Steven Holmes, Yunpeng Yin, Anthony Schepis, Michael Cicoria, David Hetzer, Hsinyu Tsai, Michael Guillorn, Melia Tjio, Joy Cheng, Mark Somervell, Matthew Colburn, "Directed self-assembly process implementation in a 300mm pilot line environment", Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801G (26 March 2013); doi: 10.1117/12.2011610; https://doi.org/10.1117/12.2011610

ACCESS THE FULL ARTICLE

PERSONAL SIGN IN
Full access may be available with your subscription

Email or Username Forgot your username?

Password Forgot your password?

Show

Remember Email/Username on this computer

Remember Password

No SPIE account? Create an account
or Institutional Sign In via Shibboleth

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $14.40

Non-members: $18.00 ADD TO CART

Show All Keywords

Keywords/Phrases

Search In:

Publication Years