26 March 2013 Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly
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Abstract
Dissipative particle dynamics (DPD) simulations are utilized to optimize contact hole shrink process using graphoepitaxial directed self-assembly (DSA). In this work, poly (styrene-block-methyl methacrylate) (PS-b-PMMA) was employed. In the contact hole shrink process, PS residual layer was formed on the bottom floor of the hole type prepattern. To realize reliable contact hole shrink process, minimization of the thickness of PS residual layer was one of the key issues. It was found that the minimization of the thickness of the PS residual layer and optimization of threedimensional configuration of the PMMA domain was trade-off relationship. By using DPD simulations, the parameters were successfully optimized to achieve residual layer free contact hole shrink of DSA lithography.
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Hironobu Sato, Hironobu Sato, Hiroki Yonemitsu, Hiroki Yonemitsu, Yuriko Seino, Yuriko Seino, Hirokazu Kato, Hirokazu Kato, Masahiro Kanno, Masahiro Kanno, Katsutoshi Kobayashi, Katsutoshi Kobayashi, Ayako Kawanishi, Ayako Kawanishi, Katsuyoshi Kodera, Katsuyoshi Kodera, Tsukasa Azuma, Tsukasa Azuma, } "Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly", Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801K (26 March 2013); doi: 10.1117/12.2009622; https://doi.org/10.1117/12.2009622
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