10 April 2013 On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections
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Abstract
Aggressive on-product overlay requirements in advanced nodes are setting a superior challenge for the semiconductor industry. This forces the industry to look beyond the traditional way-of-working and invest in several new technologies. Integrated metrology2, in-chip overlay control, advanced sampling and process correction-mechanism (using the highest order of correction possible with scanner interface today), are a few of such technologies considered in this publication.
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Kaustuve Bhattacharyya, Kaustuve Bhattacharyya, Chih-Ming Ke, Chih-Ming Ke, Guo-Tsai Huang, Guo-Tsai Huang, Kai-Hsiung Chen, Kai-Hsiung Chen, Henk-Jan H. Smilde, Henk-Jan H. Smilde, Andreas Fuchs, Andreas Fuchs, Martin Jak, Martin Jak, Mark van Schijndel, Mark van Schijndel, Murat Bozkurt, Murat Bozkurt, Maurits van der Schaar, Maurits van der Schaar, Steffen Meyer, Steffen Meyer, Miranda Un, Miranda Un, Stephen Morgan, Stephen Morgan, Jon Wu, Jon Wu, Vincent Tsai, Vincent Tsai, Frida Liang, Frida Liang, Arie den Boef, Arie den Boef, Peter ten Berge, Peter ten Berge, Michael Kubis, Michael Kubis, Cathy Wang, Cathy Wang, Christophe Fouquet, Christophe Fouquet, L. G. Terng, L. G. Terng, David Hwang, David Hwang, Kevin Cheng, Kevin Cheng, TS Gau, TS Gau, Y. C. Ku, Y. C. Ku, } "On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868104 (10 April 2013); doi: 10.1117/12.2011878; https://doi.org/10.1117/12.2011878
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