10 April 2013 On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections
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Abstract
Aggressive on-product overlay requirements in advanced nodes are setting a superior challenge for the semiconductor industry. This forces the industry to look beyond the traditional way-of-working and invest in several new technologies. Integrated metrology2, in-chip overlay control, advanced sampling and process correction-mechanism (using the highest order of correction possible with scanner interface today), are a few of such technologies considered in this publication.
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Kaustuve Bhattacharyya, Chih-Ming Ke, Guo-Tsai Huang, Kai-Hsiung Chen, Henk-Jan H. Smilde, Andreas Fuchs, Martin Jak, Mark van Schijndel, Murat Bozkurt, Maurits van der Schaar, Steffen Meyer, Miranda Un, Stephen Morgan, Jon Wu, Vincent Tsai, Frida Liang, Arie den Boef, Peter ten Berge, Michael Kubis, Cathy Wang, Christophe Fouquet, L. G. Terng, David Hwang, Kevin Cheng, TS Gau, Y. C. Ku, "On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868104 (10 April 2013); doi: 10.1117/12.2011878; https://doi.org/10.1117/12.2011878
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