18 April 2013 Nanoscale modulus and surface chemistry characterization for collapse free resists
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One of the key challenges to high resolution resist patterning is pattern collapse. Using a new scanning probe microscopy (SPM), Peak ForceTM tapping, we map nano-mechanical properties-- modulus, adhesion, and dissipation-- of the exposed/developed resist structures with sub-10 nm resolution. Properties are compared across a carbon based negative resist with and without cross-linking. The SPM technique reveals that cross-linking significantly enhances the mechanical properties to give a champion resolution of sub 20 nm half-pitch in a chemically amplified negative resist system. Beyond mechanical properties, surface morphology and redistribution kinetics were examined using complementary techniques and reveal additional benefits with cross-linking.
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Prashant K. Kulshreshtha, Prashant K. Kulshreshtha, Ken Maruyama, Ken Maruyama, Sara Kiani, Sara Kiani, Dominik Ziegler, Dominik Ziegler, James Blackwell, James Blackwell, Deidre Olynick, Deidre Olynick, Paul D. Ashby, Paul D. Ashby, } "Nanoscale modulus and surface chemistry characterization for collapse free resists", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86810O (18 April 2013); doi: 10.1117/12.2011657; https://doi.org/10.1117/12.2011657

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