Paper
10 April 2013 Scatterometry accuracy improvement using 3D shapes
Shahin Zangooie, Satyanarayana Myneni, Peter Wilkens, Nicholas J. Keller, Thankasala P. Sarathy, Milad Tabet
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Abstract
A non-destructive and fast optical solution for characterization of high aspect ratio and isolated 3D hard disk drive writer head air bearing surface structure is presented in this paper. While 2D gratings are plagued by line bending and accuracy problems, the 3D scatterometry test structures show superior mechanical stability and device resemblance necessary for an accurate measurement capability at a reactive ion etch process step enabling further ion mill shape predictability prior to a point of no return in the process. The scatterometry post RIE measurement on the 3D test targets show R^2 about five times better than dual beam FIB and a correlation slope roughly 3 times closer to unity. The post RIE scatterometry wafer sigma is in average 49% of the post RIE FIB sigma and 77% of the post ion mill FIB sigma.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shahin Zangooie, Satyanarayana Myneni, Peter Wilkens, Nicholas J. Keller, Thankasala P. Sarathy, and Milad Tabet "Scatterometry accuracy improvement using 3D shapes", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86811S (10 April 2013); https://doi.org/10.1117/12.2011616
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Cited by 1 scholarly publication.
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KEYWORDS
Scatterometry

Reactive ion etching

3D metrology

Semiconducting wafers

3D acquisition

Ions

Critical dimension metrology

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