Paper
18 April 2013 Design-based metrology for development and manufacturing applications
Peter Brooker, Michael Lee, Ezequiel Vidal Russel, Shimon Levi, Sylvain Berthiaume, William A. Stanton, Travis Brist
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Abstract
This work presents how the combination of EDA and CDSEM tools enable development and manufacturing engineers to collect CDSEM data of a large diversity of features and contexts seamlessly for OPC model calibration and validation, process development, and inline manufacturing monitoring. We will present the application and results of a solution proposed in a previously published paper[1] and then review the benefits of enabling development and manufacturing engineers to make metrology-related decisions within their environments. Finally, new applications for automated CDSEM recipe generation and data collection will be discussed.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Brooker, Michael Lee, Ezequiel Vidal Russel, Shimon Levi, Sylvain Berthiaume, William A. Stanton, and Travis Brist "Design-based metrology for development and manufacturing applications", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868123 (18 April 2013); https://doi.org/10.1117/12.2014182
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KEYWORDS
Scanning electron microscopy

Metrology

Manufacturing

Optical proximity correction

Semiconducting wafers

Data modeling

Reticles

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