29 March 2013 Progress in directed self-assembly hole shrink applications
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Abstract
Directed Self-Assembly (DSA) has become a promising alternative for generating fine lithographic patterns. Since contact holes are among the most difficult structures to resolve through traditional lithographic means, directed selfassembly applications that generate smaller contact holes are of particular interest to the industry. In this paper, DSA integrations that shrink pre-patterned contact holes were explored. The use of both block copolymers (BCPs)1 and blended polymer systems2 was considered. In addition, both wet3 and dry4 techniques were used to develop the central core out of the respective phase-separated morphologies. Finally, the hole patterns created through the various contact hole applications were transferred to substrates of interest with the goal of incorporating them into an IMEC 28 nm node via chain electrical test vehicle for direct, side-by-side comparison.
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Todd R. Younkin, Todd R. Younkin, Roel Gronheid, Roel Gronheid, Paulina Rincon Delgadillo, Paulina Rincon Delgadillo, Boon Teik Chan, Boon Teik Chan, Nadia Vandenbroeck, Nadia Vandenbroeck, Steven Demuynck, Steven Demuynck, Ainhoa Romo-Negreira, Ainhoa Romo-Negreira, Doni Parnell, Doni Parnell, Kathleen Nafus, Kathleen Nafus, Shigeru Tahara, Shigeru Tahara, Mark Somervell, Mark Somervell, } "Progress in directed self-assembly hole shrink applications", Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820L (29 March 2013); doi: 10.1117/12.2012353; https://doi.org/10.1117/12.2012353
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