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29 March 2013 Progress in directed self-assembly hole shrink applications
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Directed Self-Assembly (DSA) has become a promising alternative for generating fine lithographic patterns. Since contact holes are among the most difficult structures to resolve through traditional lithographic means, directed selfassembly applications that generate smaller contact holes are of particular interest to the industry. In this paper, DSA integrations that shrink pre-patterned contact holes were explored. The use of both block copolymers (BCPs)1 and blended polymer systems2 was considered. In addition, both wet3 and dry4 techniques were used to develop the central core out of the respective phase-separated morphologies. Finally, the hole patterns created through the various contact hole applications were transferred to substrates of interest with the goal of incorporating them into an IMEC 28 nm node via chain electrical test vehicle for direct, side-by-side comparison.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Todd R. Younkin, Roel Gronheid, Paulina Rincon Delgadillo, Boon Teik Chan, Nadia Vandenbroeck, Steven Demuynck, Ainhoa Romo-Negreira, Doni Parnell, Kathleen Nafus, Shigeru Tahara, and Mark Somervell "Progress in directed self-assembly hole shrink applications", Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820L (29 March 2013);

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