Reduced resist consumption (RRC) process is used to reduce chemical shot sizes by 75% or more. However, as we move to smaller technology nodes, the impurities in RRC solvents are becoming increasingly more problematic. In this study, a series of experiments were conducted to reduce total defectivity via RRC process optimization. The 20nm metal layer is optimized for defect reduction at the OPL/BARC interface. This study looks at the effects of no RRC, static RRC dispense condition, dynamic RRC dispense condition, the number of RRC puddles, puddle times and post apply bake (PAB) temperatures. Overall, a 45% reduction in total raw defects is achieved over current production recipes. The reduction, however, comes at the cost of an increase in line and space defects and single line open (SLO) defects. The line and space defects increased by 62% and the SLO defects had a 40% increase.