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12 April 2013 Avoiding wafer-print artifacts in spacer is dielectric (SID) patterning
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For patterning the upper Metal layers of the 10 nm node, Spacer Is Dielectric (SID) Patterning is the leading candidate. Compared to Litho-Etch-Litho-Etch Double Patterning, SID has lower line-width roughness, tighter line-end spacing, and lower sensitivity to overlay errors. However, SID places more restrictions on design, and creates wafer-printing artifacts or “spurs.” These printing artifacts arise because SID uses a subtractive trim etch to create “negative contours,” which are very different from the positive contours of single-exposure patterning. In this work, we show the origin of these spurs, and present rule-based decomposition methods to avoid or mitigate them.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerard Luk-Pat, Ben Painter, Alex Miloslavsky, Peter De Bisschop, Adam Beacham, and Kevin Lucas "Avoiding wafer-print artifacts in spacer is dielectric (SID) patterning", Proc. SPIE 8683, Optical Microlithography XXVI, 868312 (12 April 2013);

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