12 April 2013 Lens heating impact analysis and controls for critical device layers by computational method
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Abstract
We report that, based on our experimental data, lens heating (LH) impact on wafer image can be effectively controlled by using a computational method (cASCAL) on critical device layers with no request on tool time. As design rule shrinks down, LH control plays a key role in preventing the image deterioration caused by the LH-induced wavefront distortion during exposure. To improve LH prediction accuracy, 3-dimension structure of mask stack (M3D) is considered in calculating the electro-magnetic (EM) field that passes through the mask for full chip. Additionally, lens specific calibration (LSC) is performed on individual scanners to take the lens-to-lens variation into account. In data comparisons, we show that cASCAL performs very well as an ASCAL substitute, and that M3D and LSC improve the LH prediction accuracy of cASCAL.
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Du Hyun Beak, Jin Phil Choi, Tony Park, Young Sun Nam, Young Seog Kang, Chan-Hoon Park, Ki-Yeop(Chris) Park, Chang-Hoon Ryu, Wenjin Huang, Ki-Ho Baik, "Lens heating impact analysis and controls for critical device layers by computational method", Proc. SPIE 8683, Optical Microlithography XXVI, 86831Q (12 April 2013); doi: 10.1117/12.2012135; https://doi.org/10.1117/12.2012135
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