Detailed routing with advanced flexibility and in compliance with self-aligned double patterning constraints

Fumiharu Nakajima; Chikaaki Kodama; Hirotaka Ichikawa; Koichi Nakayama; Shigeki Nojima; Toshiya Kotani; Shoji Mimotogi; Shinji Miyamoto

doi:10.1117/12.2010644

29 March 2013 Detailed routing with advanced flexibility and in compliance with self-aligned double patterning constraints

Fumiharu Nakajima, Chikaaki Kodama, Hirotaka Ichikawa, Koichi Nakayama, Shigeki Nojima, Toshiya Kotani, Shoji Mimotogi, Shinji Miyamoto

Author Affiliations +

Proceedings Volume 8684, Design for Manufacturability through Design-Process Integration VII; 86840A (2013) https://doi.org/10.1117/12.2010644
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

In this paper, we propose a new flexible routing method for Self-Aligned Double Patterning (SADP). SADP is one of the most promising candidates for patterning sub-20 nm node advanced technology but wafer images must satisfy tighter constraints than litho-etch-litho-etch process. Previous SADP routing methods require strict constraints induced from the relation between mandrel and trim patterns, so design freedom is unexpectedly lost. Also these methods assume to form narrow patterns by trimming process without consideration of resolution limit of optical lithography. The proposed method realizes flexible SADP routing with dynamic coloring requiring no decomposition to extract mandrel patterns and no worries about coloring conflicts. The proposed method uses realizable trimming process only for insulation of patterns. The effectiveness of the proposed method is confirmed in the experimental comparisons.

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Fumiharu Nakajima, Chikaaki Kodama, Hirotaka Ichikawa, Koichi Nakayama, Shigeki Nojima, Toshiya Kotani, Shoji Mimotogi, and Shinji Miyamoto "Detailed routing with advanced flexibility and in compliance with self-aligned double patterning constraints", Proc. SPIE 8684, Design for Manufacturability through Design-Process Integration VII, 86840A (29 March 2013); https://doi.org/10.1117/12.2010644

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