29 March 2013 Detailed routing with advanced flexibility and in compliance with self-aligned double patterning constraints
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Abstract
In this paper, we propose a new flexible routing method for Self-Aligned Double Patterning (SADP). SADP is one of the most promising candidates for patterning sub-20 nm node advanced technology but wafer images must satisfy tighter constraints than litho-etch-litho-etch process. Previous SADP routing methods require strict constraints induced from the relation between mandrel and trim patterns, so design freedom is unexpectedly lost. Also these methods assume to form narrow patterns by trimming process without consideration of resolution limit of optical lithography. The proposed method realizes flexible SADP routing with dynamic coloring requiring no decomposition to extract mandrel patterns and no worries about coloring conflicts. The proposed method uses realizable trimming process only for insulation of patterns. The effectiveness of the proposed method is confirmed in the experimental comparisons.
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Fumiharu Nakajima, Fumiharu Nakajima, Chikaaki Kodama, Chikaaki Kodama, Hirotaka Ichikawa, Hirotaka Ichikawa, Koichi Nakayama, Koichi Nakayama, Shigeki Nojima, Shigeki Nojima, Toshiya Kotani, Toshiya Kotani, Shoji Mimotogi, Shoji Mimotogi, Shinji Miyamoto, Shinji Miyamoto, } "Detailed routing with advanced flexibility and in compliance with self-aligned double patterning constraints", Proc. SPIE 8684, Design for Manufacturability through Design-Process Integration VII, 86840A (29 March 2013); doi: 10.1117/12.2010644; https://doi.org/10.1117/12.2010644
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