29 March 2013 Post-routing back-end-of-line layout optimization for improved time-dependent dielectric breakdown reliability
Author Affiliations +
Time-dependent dielectric breakdown (TDDB) is becoming a critical reliability issue, since the electric field across dielectric increases as technology scales. Moreover, dielectric reliability is aggravated when interconnect spacings vary due to (vias and wires) mask misalignment. Although dielectric reliability can be mitigated by a larger interconnect pitch, such a guardband leads to significant area overhead. In this paper, we propose to improve dielectric reliability through a post-layout optimization. In the layout optimization, we locally shave and/or shift a fraction of wire width to increase the spacing between wires, and/or between adjacent-layer vias and wires. Our experimental results show that the layout optimization can improve interconnect lifetime by 9% to 10%. Separately, we also propose a signal-aware chip-level TDDB reliability estimation method which estimates TDDB stress time of interconnects using net signals obtained from a vectorless analysis. By using the signal-aware analysis method, we show that chip-level TDDB lifetime is approximately twice that obtained using the conventional analysis approach which assumes interconnects are always under electrical stress.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tuck-Boon Chan, Tuck-Boon Chan, Andrew B. Kahng, Andrew B. Kahng, } "Post-routing back-end-of-line layout optimization for improved time-dependent dielectric breakdown reliability", Proc. SPIE 8684, Design for Manufacturability through Design-Process Integration VII, 86840L (29 March 2013); doi: 10.1117/12.2011645; https://doi.org/10.1117/12.2011645


Back to Top