3D RF integration at VTT

Tauno Vähä-Heikkilä

doi:10.1117/12.2012001

9 April 2013 3D RF integration at VTT

Tauno Vähä-Heikkilä

Proceedings Volume 8691, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2013; 86910V (2013) https://doi.org/10.1117/12.2012001
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2013, San Diego, California, United States

Abstract

Integration of multiple chips and functions to the same radio module is a key issue when the size of a radio front-end is tried to minimize. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for radio frequency (RF) integrated modules. Three dimensional (3D) integration technologies are enablers for realizing compact multi-chip modules with several different technologies in the same module. In addition to module level integration, both technologies are used for realizing high quality factor passive components.

Citation Download Citation

Tauno Vähä-Heikkilä "3D RF integration at VTT", Proc. SPIE 8691, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2013, 86910V (9 April 2013); https://doi.org/10.1117/12.2012001

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available