9 April 2013 3D RF integration at VTT
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Abstract
Integration of multiple chips and functions to the same radio module is a key issue when the size of a radio front-end is tried to minimize. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for radio frequency (RF) integrated modules. Three dimensional (3D) integration technologies are enablers for realizing compact multi-chip modules with several different technologies in the same module. In addition to module level integration, both technologies are used for realizing high quality factor passive components.
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Tauno Vähä-Heikkilä, Tauno Vähä-Heikkilä, } "3D RF integration at VTT", Proc. SPIE 8691, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2013, 86910V (9 April 2013); doi: 10.1117/12.2012001; https://doi.org/10.1117/12.2012001
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