18 June 2013 A practical approach to LWIR wafer-level optics for thermal imaging systems
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The development and implementation of wafer level packaging for commercial microbolometers has opened the pathway towards full wafer-based thermal imaging systems. The next challenge in development is moving from discrete element LWIR imaging systems to a wafer based optical system, similar to lens assemblies found in cell phone cameras. This paper will compare a typical high volume thermal imaging design manufactured from discrete lens elements to a similar design optimized for manufacture through a wafer based approach. We will explore both performance and cost tradeoffs as well as review the manufacturability of all designs.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alan Symmons, Alan Symmons, Ray Pini, Ray Pini, "A practical approach to LWIR wafer-level optics for thermal imaging systems", Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 870425 (18 June 2013); doi: 10.1117/12.2015254; https://doi.org/10.1117/12.2015254


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