19 June 2013 Wafer-level reliability characterization for wafer-level packaged microbolometer with ultra-small array size
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For the development of small and low cost microbolometer, wafer level reliability characterization techniques of vacuum packaged wafer are introduced. Amorphous silicon based microbolometer-type vacuum sensors fabricated in 8 inch wafer are bonded with cap wafer by Au-Sn eutectic solder. Membrane deflection and integrated vacuum sensor techniques are independently used to characterize the hermeticity in a wafer-level. For the packaged wafer with membrane thickness below 100um, it is possible to determine the hermeticity as screening test by optical detection technique. Integrated vacuum sensor having the same structure as bolometer pixel shows the vacuum level below 100mTorr. All steps from packaging process to fine hermeticity test are implemented in wafer level to prove the high volume and low cost production.
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Hee Yeoun Kim, Hee Yeoun Kim, Chungmo Yang, Chungmo Yang, Jae Hong Park, Jae Hong Park, Ho Jung, Ho Jung, Taehyun Kim, Taehyun Kim, Kyung Tae Kim, Kyung Tae Kim, Sung Kyu Lim, Sung Kyu Lim, Sang Woo Lee, Sang Woo Lee, Jay Mitchell, Jay Mitchell, Wook Joong Hwang, Wook Joong Hwang, Kwyro Lee, Kwyro Lee, } "Wafer-level reliability characterization for wafer-level packaged microbolometer with ultra-small array size", Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87043E (19 June 2013); doi: 10.1117/12.2015738; https://doi.org/10.1117/12.2015738


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