Grain edge detection of diamond grinding wheel

Lijun Zhou; Changcai Cui; Chunqi Huang; Hui Huang; Ruifang Ye

doi:10.1117/12.2014856

Translator Disclaimer

31 January 2013 Grain edge detection of diamond grinding wheel

Lijun Zhou, Changcai Cui, Chunqi Huang, Hui Huang, Ruifang Ye

Author Affiliations +

Proceedings Volume 8759, Eighth International Symposium on Precision Engineering Measurement and Instrumentation; 87591J (2013) https://doi.org/10.1117/12.2014856
Event: International Symposium on Precision Engineering Measurement and Instrumentation 2012, 2012, Chengdu, China

Abstract

The topograpgy characterization of grinding wheel grain is indispensable for precision grinding, it depends on accurate edge detecting and recognition of abrasive grains from wheel bond to a large extent. Due to different reflective characteristics arising among different materials, difference between maximum and minimum intensity (Δ ) of diamond is larger than that of bond. This paper uses a new method for grain edge detection of resin-bonded diamond grinding wheel that combines the improved Canny operator in Method of Maximum Classes Square Error (called as OTSU) with ΔI obtained by the white light interferometry (WLI). The experimental results show that the method based on improved Canny operator can effectively detect the edge of diamond grain.

Citation Download Citation

Lijun Zhou, Changcai Cui, Chunqi Huang, Hui Huang, and Ruifang Ye "Grain edge detection of diamond grinding wheel", Proc. SPIE 8759, Eighth International Symposium on Precision Engineering Measurement and Instrumentation, 87591J (31 January 2013); https://doi.org/10.1117/12.2014856

ACCESS THE FULL ARTICLE