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17 May 2013 Shortening of the process chain by tactile inline measurement
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Proceedings Volume 8763, Smart Sensors, Actuators, and MEMS VI; 87632V (2013)
Event: SPIE Microtechnologies, 2013, Grenoble, France
This article describes the application of a microelectromechanical system (MEMS) with a beam-shaped cantilever and an integrated piezo-resistive measuring bridge. This device is used for a quick inline control of building panels, which consist of different materials (e.g. metals, polymers and elastomers). The micro sensing device distinguishes itself by a comparatively very low probing force (<100 μN), a high natural frequency (<2.7 kHz) and a very small mass (≈ 0.1 mg). Measuring speeds up to approx. 10 mm/s can be realized. In addition, this sensor comes with a typical resolution in vertical displacement of 2 nm (due to noise floor Δf = 1,6 kHz).
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lutz Doering, Nicole Thronicke, Christian Löbner, Thomas Frank, Steffen Reich, Stefan Völlmeke, and Arndt Steinke "Shortening of the process chain by tactile inline measurement", Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632V (17 May 2013);

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