PROCEEDINGS VOLUME 8767
SPIE MICROTECHNOLOGIES | 24-26 APRIL 2013
Integrated Photonics: Materials, Devices, and Applications II
Proceedings Volume 8767 is from: Logo
SPIE MICROTECHNOLOGIES
24-26 April 2013
Grenoble, France
Front Matter: Volume 8767
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876701 (29 May 2013); doi: 10.1117/12.2031895
Micro Cavities and Micro Resonators
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876702 (22 May 2013); doi: 10.1117/12.2016896
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876703 (22 May 2013); doi: 10.1117/12.2018316
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876704 (22 May 2013); doi: 10.1117/12.2017400
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876705 (22 May 2013); doi: 10.1117/12.2016914
Photonic Materials
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876706 (22 May 2013); doi: 10.1117/12.2017296
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876707 (22 May 2013); doi: 10.1117/12.2018509
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876708 (22 May 2013); doi: 10.1117/12.2017088
Ge-Based Devices
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670A (22 May 2013); doi: 10.1117/12.2016865
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670B (22 May 2013); doi: 10.1117/12.2017249
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670C (22 May 2013); doi: 10.1117/12.2017168
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670D (22 May 2013); doi: 10.1117/12.2017008
Photonics Platform I
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670E (22 May 2013); doi: 10.1117/12.2020574
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670F (22 May 2013); doi: 10.1117/12.2020575
Photonics Platform II
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670G (22 May 2013); doi: 10.1117/12.2017053
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670H (22 May 2013); doi: 10.1117/12.2020576
Materials and Devices for Light Emission
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670I (22 May 2013); doi: 10.1117/12.2017250
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670J (22 May 2013); doi: 10.1117/12.2017227
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670L (22 May 2013); doi: 10.1117/12.2017274
Si and InP Based Devices
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670M (22 May 2013); doi: 10.1117/12.2017431
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670N (29 May 2013); doi: 10.1117/12.2017327
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670P (22 May 2013); doi: 10.1117/12.2017540
Nanostructures and Nanophotonics
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670Q (22 May 2013); doi: 10.1117/12.2017307
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670R (22 May 2013); doi: 10.1117/12.2017229
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670S (22 May 2013); doi: 10.1117/12.2017026
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670T (22 May 2013); doi: 10.1117/12.2017561
Organic and Hybrid Devices
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670U (22 May 2013); doi: 10.1117/12.2017485
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670V (22 May 2013); doi: 10.1117/12.2016763
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670W (22 May 2013); doi: 10.1117/12.2016676
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670X (22 May 2013); doi: 10.1117/12.2016652
Poster Session
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876710 (22 May 2013); doi: 10.1117/12.2017275
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876712 (22 May 2013); doi: 10.1117/12.2016954
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 876713 (22 May 2013); doi: 10.1117/12.2017242
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