Application of digital image correlation for long-distance bridge deflection measurement

Long Tian; Bing Pan; Youfa Cai; Hui Liang; Yan Zhao

doi:10.1117/12.2020139

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22 June 2013 Application of digital image correlation for long-distance bridge deflection measurement

Long Tian, Bing Pan, Youfa Cai, Hui Liang, Yan Zhao

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Proceedings Volume 8769, International Conference on Optics in Precision Engineering and Nanotechnology (icOPEN2013); 87692V (2013) https://doi.org/10.1117/12.2020139
Event: International Conference on Optics in Precision Engineering and Nanotechnology (icOPEN2013), 2013, Singapore, Singapore

Abstract

Due to its advantages of non-contact, full-field and high-resolution measurement, digital image correlation (DIC) method has gained wide acceptance and found numerous applications in the field of experimental mechanics. In this paper, the application of DIC for real-time long-distance bridge deflection detection in outdoor environments is studied. Bridge deflection measurement using DIC in outdoor environments is more challenging than regular DIC measurements performed under laboratory conditions. First, much more image noise due to variations in ambient light will be presented in the images recorded in outdoor environments. Second, how to select the target area becomes a key factor because long-distance imaging results in a large field of view of the test object. Finally, the image acquisition speed of the camera must be high enough (larger than 100 fps) to capture the real-time dynamic motion of a bridge. In this work, the above challenging issues are addressed and several improvements were made to DIC method. The applicability was demonstrated by real experiments. Experimental results indicate that the DIC method has great potentials in motion measurement in various large building structures.

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Long Tian, Bing Pan, Youfa Cai, Hui Liang, and Yan Zhao "Application of digital image correlation for long-distance bridge deflection measurement", Proc. SPIE 8769, International Conference on Optics in Precision Engineering and Nanotechnology (icOPEN2013), 87692V (22 June 2013); https://doi.org/10.1117/12.2020139

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