Paper
24 January 2013 Schottky-barrier diode array fabrication with self-aligned Ni silicidation for low power phase-change memory application
Yan Liu, Zhitang Song, Bo Liu, Houpeng Chen, Guanping Wu, Chao Zhang, Lianhong Wang, Lei Wang, Songlin Feng
Author Affiliations +
Proceedings Volume 8782, 2012 International Workshop on Information Storage and Ninth International Symposium on Optical Storage; 878213 (2013) https://doi.org/10.1117/12.2018456
Event: 2012 International Workshop on Information Data Storage and Ninth International Symposium on Optical Storage, 2012, Shanghai, China
Abstract
A high density design of Schottky-barrier diode array with self-aligned nickel-silicidation under 40nm technology node fabricated on epitaxial layer for low power phase-change memory application is proposed. According to N-type doping profile from simulation, large ON/OFF current ratio, the lower barrier height of ФB and series resistance RS are all determined by the dosage of buried N+ layer, epitaxial layer thickness. In addition, the temperature effect of the Schottky diode array is demonstrated by I-V electrical characteristics. From the optimal silicon-based results, a 9F2 16 × 16 diode array with the ideality factor of 1.21~1.40 shows a drive current density of ~14.9 mA/μm2, a Jon/Joff ratio of ~5.17×103, and crosstalk immunity. Furthermore, this calibrated physical model makes it possible to predict and improve the performance of accessing device array next generation for non-volatile memory application.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yan Liu, Zhitang Song, Bo Liu, Houpeng Chen, Guanping Wu, Chao Zhang, Lianhong Wang, Lei Wang, and Songlin Feng "Schottky-barrier diode array fabrication with self-aligned Ni silicidation for low power phase-change memory application", Proc. SPIE 8782, 2012 International Workshop on Information Storage and Ninth International Symposium on Optical Storage, 878213 (24 January 2013); https://doi.org/10.1117/12.2018456
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KEYWORDS
Diodes

Resistance

Silicon

Platinum

Array processing

TCAD

Nickel

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