9 August 2013 Micro CVD diamond heat sink
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Proceedings Volume 8793, Fourth International Conference on Smart Materials and Nanotechnology in Engineering; 87930I (2013) https://doi.org/10.1117/12.2027931
Event: Fourth International Conference on Smart Materials and Nanotechnology in Engineering, 2013, Gold Coast, Australia
Abstract
Chemical vapor deposition (CVD) diamond film has broad application prospect as heat sink in microelectronic field for its excellent thermal conductivity. The micro CVD diamond heat sinks with the size of 50μm×100μm×2000μm were prepared using mould copy technique. The micro silicon moulds for deposition of micro CVD diamond heat sinks were fabricated using inductivity coupling plasma (ICP) etching process. Micro CVD diamond heat sinks were synthesized under 2% methane and 98% hydrogen by hot filament CVD (HFCVD) method. The micro CVD diamond heat sinks were investigated by SEM, Raman and photo thermal deflection. The results show that favorable micro CVD heat sinks having a thermal conductivity of 960W·m-1·K-1 can be prepared by mould copy technique.
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Wenzhuang Lu, Guoping Ai, Pin Li, Yuli Sun, Dan Zhang, Dunwen Zuo, "Micro CVD diamond heat sink", Proc. SPIE 8793, Fourth International Conference on Smart Materials and Nanotechnology in Engineering, 87930I (9 August 2013); doi: 10.1117/12.2027931; https://doi.org/10.1117/12.2027931
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