9 August 2013 Relationship between coefficient of friction and surface roughness of wafer in nanomachining process
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Proceedings Volume 8793, Fourth International Conference on Smart Materials and Nanotechnology in Engineering; 87931Y (2013) https://doi.org/10.1117/12.2027965
Event: Fourth International Conference on Smart Materials and Nanotechnology in Engineering, 2013, Gold Coast, Australia
Abstract
Fixed abrasive polishing technology can obtain a nanoscale surface and is one of the future nano machining directions. The coefficient of friction between the pad and the wafer in the polishing process can influence on the surface quality of the wafer. The relationship between the coefficient of friction and surface roughness of the wafer was investigated to improve the efficiency and surface quality. Based on the Florida model, the adhesion, asperity plough and abrasive plough from the pad in the polishing process was analyzed. The friction force per unit area was calculated by the properties of the pad and wafer. Based on the rod model, the actual contact area was calculated by the surface roughness and the properties of the pad and wafer. The relational model between the surface roughness of the wafer and the friction coefficient was established. The model was verified by the experiments of fixed abrasive polishing of BK7 glass. When the friction coefficient is less than 1.9, the data of the experiment and theory match very well in the comparison process.
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Jun Li, Jun Li, Lei Xia, Lei Xia, Pengpeng Li, Pengpeng Li, Yongwei Zhu, Yongwei Zhu, Yuli Sun, Yuli Sun, Dunwen Zuo, Dunwen Zuo, } "Relationship between coefficient of friction and surface roughness of wafer in nanomachining process", Proc. SPIE 8793, Fourth International Conference on Smart Materials and Nanotechnology in Engineering, 87931Y (9 August 2013); doi: 10.1117/12.2027965; https://doi.org/10.1117/12.2027965
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