The reliability of bypass diodes in PV modules

Neelkanth G. Dhere; Narendra Shiradkar; Eric Schneller; Vivek Gade

doi:10.1117/12.2026782

24 September 2013 The reliability of bypass diodes in PV modules

Neelkanth G. Dhere, Narendra Shiradkar, Eric Schneller, Vivek Gade

Proceedings Volume 8825, Reliability of Photovoltaic Cells, Modules, Components, and Systems VI; 88250I (2013) https://doi.org/10.1117/12.2026782
Event: SPIE Solar Energy + Technology, 2013, San Diego, California, United States

Abstract

The operating conditions of bypass diodes in PV modules deployed in the field are considerably harsher than the conditions at which the diode manufacturers test the diodes. This has a potential to significantly reduce the operating life of bypass diodes and has raised concerns about the safety and reliability of PV modules as a whole. The study of modes and mechanisms of the failures encountered in bypass diodes used in PV modules can provide important information which would be useful to predict the module lifetime. This paper presents the review of the failure modes and mechanisms observed in bypass diodes and current work related to reliability testing of bypass diodes. The International PV Module Quality Assurance Task Force has recommended following four potential areas of research to understand the reliability issues of bypass diodes: Electrostatic Discharge, reverse bias thermal runaway testing, forward bias overheating and transition testing of forward bias to reverse bias. As a joint collaborative effort between Florida Solar Energy Center and Solar and Environmental Test Laboratory at Jabil Inc., laboratory testing of bypass diodes on the guidelines provided by the International PV Module Quality Assurance Task Force has been initiated. Preliminary results from this work are presented in this paper.

Citation Download Citation

Neelkanth G. Dhere, Narendra Shiradkar, Eric Schneller, and Vivek Gade "The reliability of bypass diodes in PV modules", Proc. SPIE 8825, Reliability of Photovoltaic Cells, Modules, Components, and Systems VI, 88250I (24 September 2013); https://doi.org/10.1117/12.2026782

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available