Translator Disclaimer
Paper
3 October 2013 Investigation of EUVL reticle capping layer peeling under wet cleaning
Author Affiliations +
Abstract
In the absence of a pellicle, an EUVL reticle is expected to withstand up to 100 cleaning cycles. EUVL reticles constitute a complex multi-layer structure with extremely sensitive materials which are prone to damage during cleaning. The 2.5 nm thin Ru capping layer has been reported to be most sensitive to repeated cleaning, especially when exposed to aggressive dry etch or strip chemicals [1]. Such a Ru film exhibits multiple modes of failure under wet cleaning processes. In this study we investigated the Ru peeling effect. IR-induced thermo-stress in the multilayer and photochemical-induced radical attack on the surface are investigated as the two most dominant contributors to Ru damage in cleaning. Results of this investigation are presented and corrective actions are proposed.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sherjang Singh, Davide Dattilo, Uwe Dietze, Arun John Kadaksham, Il-Yong Jang, and Frank Goodwin "Investigation of EUVL reticle capping layer peeling under wet cleaning", Proc. SPIE 8880, Photomask Technology 2013, 888010 (3 October 2013); https://doi.org/10.1117/12.2031430
PROCEEDINGS
10 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Interactions of 3D mask effects and NA in EUV lithography
Proceedings of SPIE (November 08 2012)
Assessing out of band flare effects at the wafer level...
Proceedings of SPIE (March 22 2010)
Lifetime of EUVL masks as a function of degree of...
Proceedings of SPIE (March 27 2008)
EUV masks under exposure: practical considerations
Proceedings of SPIE (April 05 2011)
Electron beam inspection of 16nm HP node EUV masks
Proceedings of SPIE (November 08 2012)

Back to Top