25 July 2013 Selective deep wet etching of fused silica optical fibers for sensing applications
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Proceedings Volume 8902, Electron Technology Conference 2013; 89021K (2013) https://doi.org/10.1117/12.2031149
Event: Electron Technology Conference 2013, 2013, Ryn, Poland
Abstract
In the paper we discuss crucial aspects of selective deep wet etching technology of fused silica optical fibers. The technology includes preparation of the fiber, photolithography aiming to create a mask for etching, wet etching process and photoresist removal. We also discuss the influence of removing polyimide layer from the fiber, photoresist type, thickness of the photoresist and etching time. The developed technology allows for obtaining periodic variations in the fiber diameter resulting in formation of corrugated long-period grating (LPG). Introduction of strain induces appearing of attenuation peak in the transmission spectrum of the fiber. The developed technology can be also applied for fabrication of other optical fiber devices.
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Krzysztof Krogulski, Mateusz Śmietana, Norbert Kwietniewski, Krystian Król, "Selective deep wet etching of fused silica optical fibers for sensing applications", Proc. SPIE 8902, Electron Technology Conference 2013, 89021K (25 July 2013); doi: 10.1117/12.2031149; https://doi.org/10.1117/12.2031149
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