Numerical study of thermal stress damage in dielectric film by long-pulse laser

Ji-xing Cai; Guang-yong Jin; Juan Bi; Gui-bo Chen; Ye Zhang

doi:10.1117/12.2032890

Translator Disclaimer

17 September 2013 Numerical study of thermal stress damage in dielectric film by long-pulse laser

Ji-xing Cai, Guang-yong Jin, Juan Bi, Gui-bo Chen, Ye Zhang

Author Affiliations +

Proceedings Volume 8904, International Symposium on Photoelectronic Detection and Imaging 2013: High Power Lasers and Applications; 89040M (2013) https://doi.org/10.1117/12.2032890
Event: ISPDI 2013 - Fifth International Symposium on Photoelectronic Detection and Imaging, 2013, Beijing, China

Abstract

In this paper, we study and establish the theoretical model of thermal stress damage of dielectric film in film/substrate systems caused by long-pulse laser, based on which transient distributions of temperature field and thermal stress field are simulated using the finite element method(FEM) and then analyze the mechanism of the damage. In accordance with the basic equation of heat conduction equation and thermal stress equation, the physical model of dielectric film and the substrate transient temperature field and thermal stress field is developed with the assumption that the dielectric film and the substrate are isotropic and their thermal parameters do not change with temperature. On the foundation of theoretical analysis, transient of temperature field in dielectric film in film/substrate systems under long-pulse laser irradiation is simulated and calculated. The numerical results indicate that great temperature gradient exists in dielectric film and substrate in radial direction but smaller one exists in axial direction. When the laser power density is increasingly larger, the temperature gradient in radial direction is larger and the temperature in the center of the film is higher. Transient thermal stress field in dielectric film in film/substrate systems under long-pulse laser irradiation is simulated. Numerical results show that, the damage to the dielectric film caused by long-pulse laser is mainly due to thermal stress damage process which circumferential stress acts a primary role in. Such damage is a final result of the substrate being under thermal stress. For film/substrate system, the damage under long-pulse laser radiation starts from the substrate. When the laser power density is increasingly larger, the dielectric film is more vulnerable to damage and damage zone is greater. The result of this paper provides theoretical foundation not only for research of theories of dielectric film and substrate thermal stress damage and its numerical simulation under laser radiation but also for long-pulse laser technology and widening its application scope.

Citation Download Citation

Ji-xing Cai, Guang-yong Jin, Juan Bi, Gui-bo Chen, and Ye Zhang "Numerical study of thermal stress damage in dielectric film by long-pulse laser", Proc. SPIE 8904, International Symposium on Photoelectronic Detection and Imaging 2013: High Power Lasers and Applications, 89040M (17 September 2013); https://doi.org/10.1117/12.2032890

ACCESS THE FULL ARTICLE