11 September 2013 The research of flexible and portable test system for focal-plane-array chips
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Proceedings Volume 8907, International Symposium on Photoelectronic Detection and Imaging 2013: Infrared Imaging and Applications; 89073X (2013) https://doi.org/10.1117/12.2034319
Event: ISPDI 2013 - Fifth International Symposium on Photoelectronic Detection and Imaging, 2013, Beijing, China
Abstract
Focal-plane-array (FPA) chips are the most significant components in imaging systems. Complicated measurements are performed to test chips’ properties, including resolution, signal-to-noise ratio, frame rate and homogeneity. Regular test systems are usually composed of bulky and complicated instruments, which take up large space and can only be used in labs. Besides, some indispensable parts such as high-precision signal generator and high-speed data acquisition module are very expensive, resulting in a high cost of the whole system. In order to test ultraviolet and infrared FPA chips, especially in some particular environments, such as radiation exposure tests, we designed and fabricated a flexible and portable test system for FPA chips. On the basis of Field-Programmable-Gate-Array (FPGA) technology, we integrated the system into one circuit board, which is portable and convenient for out-lab circumstances. Compared to the traditional test systems, the developed system costs much lower with a reasonable accuracy sacrifice. Several ultraviolet FPA chips have been tested on the developed system. Generated signals are monitored with digital oscilloscope, and the experimental results show that the system works well and meets the design requirements.
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Bin Xu, Bin Xu, Yong-gang Yuan, Yong-gang Yuan, Xiang-yang Li, Xiang-yang Li, } "The research of flexible and portable test system for focal-plane-array chips", Proc. SPIE 8907, International Symposium on Photoelectronic Detection and Imaging 2013: Infrared Imaging and Applications, 89073X (11 September 2013); doi: 10.1117/12.2034319; https://doi.org/10.1117/12.2034319
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