Focal-plane-array (FPA) chips are the most significant components in imaging systems. Complicated measurements are performed to test chips’ properties, including resolution, signal-to-noise ratio, frame rate and homogeneity. Regular test systems are usually composed of bulky and complicated instruments, which take up large space and can only be used in labs. Besides, some indispensable parts such as high-precision signal generator and high-speed data acquisition module are very expensive, resulting in a high cost of the whole system. In order to test ultraviolet and infrared FPA chips, especially in some particular environments, such as radiation exposure tests, we designed and fabricated a flexible and portable test system for FPA chips. On the basis of Field-Programmable-Gate-Array (FPGA) technology, we integrated the system into one circuit board, which is portable and convenient for out-lab circumstances. Compared to the traditional test systems, the developed system costs much lower with a reasonable accuracy sacrifice. Several ultraviolet FPA chips have been tested on the developed system. Generated signals are monitored with digital oscilloscope, and the experimental results show that the system works well and meets the design requirements.