7 March 2014 Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping
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Abstract
A new 100μm aperture, 920nm laser diode chip was developed to improve fiber coupling efficiency and reliability. These chips have been assembled into single-emitter and multi-emitter packages with 105μm diameter fiber-coupled output. The single-emitter package is rated for 12W operation, while the multi-emitter package is rated at 140W. Power conversion efficiency is 50%. Over one year of accelerated active life testing has been completed along with a suite of passive, environmental qualification tests. These pumps have been integrated into 2kW, 4kW, and 6kW fiber laser engines that demonstrate excellent brightness, efficiency, and sheet metal cutting quality and speed.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Erik Zucker, Erik Zucker, Daniel Zou, Daniel Zou, Laura Zavala, Laura Zavala, Hongbo Yu, Hongbo Yu, Prasad Yalamanchili, Prasad Yalamanchili, Lei Xu, Lei Xu, Hui Xu, Hui Xu, David Venables, David Venables, Jay Skidmore, Jay Skidmore, Victor Rossin, Victor Rossin, Reddy Raju, Reddy Raju, Matthew Peters, Matthew Peters, Kai-Hsiu Liao, Kai-Hsiu Liao, Kong-Weng Lee, Kong-Weng Lee, Boris Kharlamov, Boris Kharlamov, Allen Hsieh, Allen Hsieh, Rupa Gurram, Rupa Gurram, James Guo, James Guo, Nicolas Guerin, Nicolas Guerin, Jeff Gregg, Jeff Gregg, Richard Duesterberg, Richard Duesterberg, Jihua Du, Jihua Du, Abdullah Demir, Abdullah Demir, Peter Cheng, Peter Cheng, Jane Cheng, Jane Cheng, Hiroaki Ishiguro, Hiroaki Ishiguro, Ruotao Li, Ruotao Li, Yuya Mizoguchi, Yuya Mizoguchi, Hiroshi Sako, Hiroshi Sako, } "Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping", Proc. SPIE 8965, High-Power Diode Laser Technology and Applications XII, 896507 (7 March 2014); doi: 10.1117/12.2038268; https://doi.org/10.1117/12.2038268
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