Laser-induced processes on the back side of dielectric surfaces using a CuSO4-based absorber liquid

Sarah Zehnder; Pierre Lorenz; Martin Ehrhardt; Klaus Zimmer; Patrick Schwaller

doi:10.1117/12.2037629

6 March 2014 Laser-induced processes on the back side of dielectric surfaces using a CuSO₄-based absorber liquid

Sarah Zehnder, Pierre Lorenz, Martin Ehrhardt, Klaus Zimmer, Patrick Schwaller

Proceedings Volume 8968, Laser-based Micro- and Nanoprocessing VIII; 896812 (2014) https://doi.org/10.1117/12.2037629
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

Micro-structured dielectric surfaces in combination with electrode structures are promising in the field of rapid prototyping of micro-sensors. In this work laser-induced back side etching and back side deposition using aqueous copper sulfate in form of a tartrate complex with formaldehyde as absorber liquid has been investigated regarding this aim. Results obtained with different laser systems ranging from UV to Near-IR and with pulse lengths from femtoseconds to nanoseconds will be presented, in order to give a wide-spread overview of the different observable effects. Depending on the specific setup and laser parameters, either well-defined compact Cu deposits, micro- or nanoscaled Cu droplets or ablation of the dielectric substrate was observed. Best quality crystalline and conducting Cu structures were achieved using ns pulses at 532 nm wavelength. Droplet formation with UV excimer laser was observed. Parameters influencing each configuration will be discussed.

Citation Download Citation

Sarah Zehnder, Pierre Lorenz, Martin Ehrhardt, Klaus Zimmer, and Patrick Schwaller "Laser-induced processes on the back side of dielectric surfaces using a CuSO₄-based absorber liquid", Proc. SPIE 8968, Laser-based Micro- and Nanoprocessing VIII, 896812 (6 March 2014); https://doi.org/10.1117/12.2037629

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KEYWORDS

Copper

Liquids

Interfaces

Pulsed laser operation

Dielectrics

Laser ablation

Laser systems engineering

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