6 March 2014 Laser embedding electronics on 3D printed objects
Author Affiliations +
Proceedings Volume 8970, Laser 3D Manufacturing; 897004 (2014) https://doi.org/10.1117/12.2044222
Event: SPIE LASE, 2014, San Francisco, California, United States
Additive manufacturing techniques such as 3D printing are able to generate reproductions of a part in free space without the use of molds; however, the objects produced lack electrical functionality from an applications perspective. At the same time, techniques such as inkjet and laser direct-write (LDW) can be used to print electronic components and connections onto already existing objects, but are not capable of generating a full object on their own. The approach missing to date is the combination of 3D printing processes with direct-write of electronic circuits. Among the numerous direct write techniques available, LDW offers unique advantages and capabilities given its compatibility with a wide range of materials, surface chemistries and surface morphologies. The Naval Research Laboratory (NRL) has developed various LDW processes ranging from the non-phase transformative direct printing of complex suspensions or inks to lase-and-place for embedding entire semiconductor devices. These processes have been demonstrated in digital manufacturing of a wide variety of microelectronic elements ranging from circuit components such as electrical interconnects and passives to antennas, sensors, actuators and power sources. At NRL we are investigating the combination of LDW with 3D printing to demonstrate the digital fabrication of functional parts, such as 3D circuits. Merging these techniques will make possible the development of a new generation of structures capable of detecting, processing, communicating and interacting with their surroundings in ways never imagined before. This paper shows the latest results achieved at NRL in this area, describing the various approaches developed for generating 3D printed electronics with LDW.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matthew A. Kirleis, Matthew A. Kirleis, Duane Simonson, Duane Simonson, Nicholas A. Charipar, Nicholas A. Charipar, Heungsoo Kim, Heungsoo Kim, Kristin M. Charipar, Kristin M. Charipar, Ray C. Y. Auyeung, Ray C. Y. Auyeung, Scott A Mathews, Scott A Mathews, Alberto Piqué, Alberto Piqué, "Laser embedding electronics on 3D printed objects", Proc. SPIE 8970, Laser 3D Manufacturing, 897004 (6 March 2014); doi: 10.1117/12.2044222; https://doi.org/10.1117/12.2044222


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