6 March 2014 Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
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Proceedings Volume 8970, Laser 3D Manufacturing; 897008 (2014) https://doi.org/10.1117/12.2044327
Event: SPIE LASE, 2014, San Francisco, California, United States
Abstract
Photonic wire bonding exploits three-dimensional (3D) two-photon lithography to fabricate single-mode connections between nanophotonic circuits that are located on different chips. The shape of the photonic wire bonds can be adjusted to the positions of the chips such that high-precision alignment becomes obsolete. The technique enables photonic multi-chip modules that combine the strengths of different optical integration platforms.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Koos, W. Freude, N. Lindenmann, S. Koeber, T. Hoose, M. R. Billah, "Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration", Proc. SPIE 8970, Laser 3D Manufacturing, 897008 (6 March 2014); doi: 10.1117/12.2044327; https://doi.org/10.1117/12.2044327
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